①pillar 1, “Chips for Europe Initiative”：Set up the Chips for Europe Initiative, to support large-scale technological capacity building throughout investment into cross-border and openly accessible innovative infrastructures set up in the Union to enable the development of cutting-edge and next-generation semiconductor technologies that will reinforce the EU’s advanced design, systems integration, and chips production capabilities. ②pillar 2, “Security of supply”: Create a framework to ensure security of supply by attracting investments and enhanced production capacities in semiconductor manufacturing as well as advanced packaging, test, and assembly via first-of-a-kind Integrated Production Facilities and Open EU Foundries. ③pillar 3, “Preparedness and Monitoring”: Set up a coordination mechanism between the Member States and the Commission for strengthening collaboration with and across Member States, monitoring the supply of semiconductors, estimate demand, anticipate shortages, trigger situations of crisis and act through a dedicated toolbox of measures. View Details >